45 x 180 mm Aluminium Profile for ESD-Safe Electronics Frames

EMS and test-equipment buyers around Bengaluru specifying an ESD-safe SMT, test-cell or clean-assembly frame need a China-export supplier that can deliver a 45 × 180 mm ten-slot section with a documented earthing path—not another catalogue of decorative anodising. GrownParts extrudes and finishes in China and ships from Shanghai or Ningbo; we do not operate a plant in Bangalore.

GrownParts ships this section from Shanghai / Ningbo as GP-SP-45180-10S-BL: 6063-T5, ~6.20 kg/m, ten 10.2 mm slots on a 45 mm pitch, cut to the frame list. This page is written for electronics-manufacturing buyers in Bengaluru and the surrounding EMS cluster who must pass an ESD audit—not for a generic framing RFQ.

What Bangalore electronics buyers actually need from a 45 × 180 frame

EMS and test-equipment builders around Bengaluru (Peenya, Electronic City, Whitefield, Hosur corridor) ask the same engineering question: can this deep section carry the machine load and sit inside the facility earthing plan? A 180 mm depth gives roughly 400 cm⁴ about the strong axis at 6.20 kg/m—enough stiffness for long SMT guards and metrology booths without jumping to a fabricated box. Ten slots on a 45 mm pitch let panels, cable trays and hinge blocks land on standard T-nuts. None of that helps if the finish isolates the frame from earth.

GrownParts is a China extrusion supplier serving export buyers. We supply an ESD-capable 45 × 180 with a bond detail you can put on a drawing. If your job is EU paperwork or typhoon wind instead, see EU-bound Maghreb supply or typhoon-zone frames.

Why sealed anodising fails an ESD control plan

Sealed aluminium oxide is a ceramic. A typical AA15 clear film sits many orders of magnitude above the dissipative band that IEC 61340-style facility plans expect on work surfaces and equipment frames. Operators see bare-looking silver metal and assume continuity; the audit probe does not. That mismatch is the most common failure mode we see on “anodised everywhere” frames imported for Indian electronics lines.

Pick the film for handling and cleaning; pick the pad for the bond. Do not abrade a sealed film on site and call it done—the fresh oxide grows before the next shift and the bond drifts out of the acceptance band.

Earth-pad detailing that survives an audit

Put the pad on the drawing before anodising. We mask a flat land (typically sized for an M8 stainless stud), run conductive anodise or conversion coat on the rest of the section, and leave the pad bare under tape until assembly. On site: abrade, fit serrated or star washer, torque the stud, and measure bond resistance with a four-wire instrument in the same shift. Record the reading on the inspection sheet that travels with the frame serial.

• One bond per frame on the member that carries the sensitive equipment is usually enough. Claiming the whole bolted assembly is a continuous conductor creates an audit problem you cannot defend.
• Slot-and-nut joints are not bonds. Both faces carry film. Continuity through a T-nut is unreliable over vibration and cleaning cycles.
• Cleanroom constraint: state ISO class and whether IPA wipe-down is daily. Packaging (timber cradle, interleaved, pad tape) is chosen so the pad arrives protected, not seeded with packing dust in a clean bay.

Section facts to freeze on the RFQ (45 × 180 / 10 slots)

Keep the engineering numbers stable so ESD finish choices do not get renegotiated as a “new product.” Envelope 45 × 180 mm; ten grooves ~10 × 10.2 mm, 10 mm mouth, 45 mm pitch, outermost pair 135 mm apart; alloy 6063-T5; wall tolerance EN 755-9 ±0.15 mm; straightness 1.5 mm/m; twist 2°; mass ~6.20 kg/m; stock 6 m, cut to frame list ±0.5 mm. MOQ 150 m. Lead time typically 22–32 days after deposit, with air freight to Bengaluru when the line install date is fixed. Loading ports: Shanghai / Ningbo. Mill certificate, coating report, surface-resistance test report, RoHS and REACH declarations available per lot.

Failure modes unique to electronics framing

1. False conductor: silver anodise passes a visual check, fails a parallel-probe check.
2. Pad drift: abraded pad left open overnight; natural oxide returns; bond climbs out of band.
3. Joint myth: assemblers trust T-nut continuity; vibration opens the path.
4. Thermal loop: 6063 moves ~23.6 µm/m·K—sub-micron fixtures need equilibration or compensation, not a different-alloy fantasy.
5. Particulate: mill-finish bundles unpacked in a clean bay without wipe protocol seed the line.

RFQ questions for Bengaluru ESD frames

What Karnataka / Tamil Nadu EMS sites typically require

Frames shipping into Karnataka or Tamil Nadu EMS sites usually combine three constraints: delivery into the plant, a member deep enough for long unsupported runs, and an electrical bonding story that will survive a customer ESD audit. A generic “6063 profile, MOQ 150 m” quote misses the audit. Conductive finish options, pad masking, and a four-wire bond record match what goods-in and the customer auditor expect. Keep decorative anodising quotes for non-bonded covers only.

If you later need arrival packing into Mumbai or an extrusion-versus-casting comparison on the same section, see the importer inspection page or the process comparison page.

Commercial supply: samples available; OEM/ODM cut lists accepted; payment T/T 30% deposit + 70% before shipment or L/C at sight; trade terms FOB / CIF / DAP; process capability covers extrusion, cut, deburr, drill, tap, pad masking, conductive anodising and conversion coating. Inspection includes parallel-probe surface resistance, eddy-current thickness, pad visual, and string-line straightness.

FAQ — ESD framing with this section